Lilly was responsible for all aspects of the business including fundraising, strategic partnership, business development. Dr. WEI is the Vice President of CSIA, President of VLSI fables chapter, CSIA. Lilly led a team to help a $170B manufacturing company to develop its acquisition strategy, execute the transaction, and obtain post-merger synergy in a successful M&A deal valued near $900M. CL holds a BS degree in Thermal Engineering from Shanghai University of Engineering Science and MBA from The University of Texas at Arlington. No persons other than those officially registered or agreed with us may attend any part of the Event. He is an IEEE senior member since 2013. Delegates requiring an interpretation service must make their own arrangements at their own expense. Domain expertise in high-speed communication circuits & systems, signal processing/coding, optimized mixed-mode architectures. Dr. Siva Sivaram is President, Technologyand Strategy,at Western Digital where he is responsible for the development of the corporate strategy and the technologies that fuel the company’s growth. AIII actively engage in the AI ecosystem development including Slingshot 2020 @ SFF x SWITCH, the World AI Conference (WAIC) SAIL Award, IBM Call for Code Hackathon, Shanghai AI Development Alliance (SAIA)., Singapore’s AI Professionals Association (AIP) and Singapore Lean Launchpad. He was selected as Shanghai Model Worker and to the National Ten Thousand Talent Program in 2016. Sabi joined Intel in 1984. formally TWG of Assembly & Packaging of the International Roadmap of Semiconductors (ITRS) and now the Heterogeneous Integration Roadmap (HIR) and the Jisso International Council (JIC) where he is actively contributing to the strategy and packaging roadmap development. Especially, advantages of higher production efficiency, more advanced process, better supply chain, and cost-efficient in CMOS compatible manufacturing are achievable in 8 inch GaN on Si. He was responsible for sales, service, and marketing during these years. A priority in the Chinese Communist Party’s (CCP) 14th Five-Year Plan (2021–25) is to strengthen China’s autonomy in semiconductor production. He has authored or co-authored more than 160 peer-reviewed technical publications. Babak Sabi is the Corporate Vice President and General Manager of Assembly and Test Technology Development. He is the managing director of the Avago Technologies Fiber GmbH in Germany, Avago Technologies Fiber Austria GmbH and a member of the supervisory board at the Munich based MIC AG, an early stage investor for high tech companies. MSD has four businesses: Material Science (MS), Life Science (LS), Spectroscopy (SPEC) and Semiconductor (Semi). Previously, he was the director of Operations at SiTime Corporation (a MEMS-based timing solution startup), where he was a pivotal contributor in building the company’s negative margin product line to positive – enabling market penetration and sales growth. Development of Wafer Level Packaging Technology: Fan-in, Fanout and 3D Integration / 从扇入、扇出到三维集成的晶圆级封装技术研发进展. He has written 10 papers on reliability physics and has received 5 Intel Achievement Awards. Tim holds over two dozen issued United States patents relating to packaging, software, equipment, process, and design. We attract senior government officials, research institutes, investors and their industry counterparts from around the world. Our global events and conferences for the semiconductor manufacturing and supply industry, bring together political, business, financial, research and industry leaders and decision makers all under one roof. Farhat Jahangir joined Quantenna in 2013 and is Senior Vice President of Manufacturing & Quality. Asia-Pacific Strategic Partnerships & Business Intelligence Director / 战略合作与商业情报总监 亚太区 ST China / 意法半导体. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage and memory,sensors and connectivity. Maoka joined Renesas in 2013 as Vice President of Corporate Planning and led the turnaround of the company after capital injection by Japanese sovereign private equity fund, INCJ. He is now Besi’s Chief Technology Officer and also responsible for strategic supply chain management and overall quality. Having worked and lived in mainland China, Hong Kong, USA, Philippines and Malaysia, he has built business successes with end customers in the areas of mobile phone chipset, wireline and wireless networking infrastructure, IoT, storage, DSL/PON gateway, surveillance, network security, and cloud/data center. Author of 100+ granted/pending US patents. At Freescale he managed the field sales and applications engineers supporting Continental Automotive. Gaurav Kaul is an AI/Big Data Consulting Architect in HPE. Lead future technology development with new services and business models beyond the current scope of divisions and BU’s, Define and implement innovation strategy including method and tools, Build up and lead new Chongqing R&D hub as general manager, Lead technical marketing activities to promote our technologies to key stakeholders, Lead business development activities to seek new technology and business fields, in which the company can generate meaningful business cases and future growth, Rutgers University, Beijing International Program; EMBA, Beta Gamma Sigma, 2001, Rice University, Houston, Texas; M.S. Steven previously spent 11 years at Maxtor Corporation, where he held multiple senior management positions, including vice president of worldwide customer engineering. Some of these are purposely set up to benefit from government incentives. In this role, he oversaw an organization of 120 employees and provided consulting services to the IT industry. By Ding Yi / Feb 23, 2021 12:26 PM / Economy. DeepBlue Technology Explainable Artificial Intelligence (XAI) Technology. The semiconductor and electronics industries continue to evolve at a rapid pace. Driven by government support, vast market and increasing R&D spending, China, Japan, South Korea and Taiwan together have become the “Big 4” semiconductor players in Asia Pacific. She is an IMAPS Fellow. He led a company-wide network of quality and reliability organizations responsible for product reliability customer satisfaction and quality business practices. ams’ novel Digitized Lateral Flow Test will enable fast, objective results that give very early insight on outbreaks. products. Proven leadership skills and instrumental at establishing research and business KPIs. We first look at the preferred fan-in WLP structures based upon reliability performance. Waltl received a master of business administration degree, with an emphasis on business economics and strategic corporate management, from the University of Innsbruck, Austria. Prior to EVG, he held several management positions at Amdahl Deutschland GmbH (Amdahl Germany Ltd.), including most recently as director of professional services for Central Europe, and country manager for Switzerland and Austria. GaNFast Power IC for AC/DC power converter. degree in Composite Materials from Shanghai Jiaotong University, and M.S. Moved to MRC (Sputter and Etch). Phil Amsrud is a senior principal analyst for the IHS Markit’s automotive semiconductor research area with a special focus on advanced driver-assistance systems (ADAS) and autonomous driving technologies. Heterogeneous Integration refers to the integration of separately manufactured components and devices into a higher packaging level. Since 2018, it has exceeded US $300 billion, about 75% of global semiconductor sales in that year. CMOS sensor as the advanced sensing tip, is around us and improving our daily life anywhere and anytime. He was most recently senior vice president of Quality for Western Digital Corporation, who oversaw the quality assurance and customer technical support functions worldwide for all of its brands. Phil holds both a Bachelor of Science in Electrical Engineering and Master of Science in Business degrees from the University of Wisconsin-Madison, US. in Finance and Accounting from San Jose State University, Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients, Strong reputation as an advisor and industry expert on Wall Street, IDC executive analyst for Intel and Qualcomm, Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industy conferences including ISS, GSA, CASPA, and SEMI. There is a clear trend towards larger die dimensions, more dense contact schemes as well as more variation in device structures. Deadlines will be communicated once we have received your delegate contract confirmation. China International Semiconductor Executive SummitOctober 12-13, 2021, For Equipment | Materials | EDA | Software Suppliers, For Foundries | OSATS | IC Design Houses | End Users, © 2021 China International Semiconductor Executive Summit, Professor of Institute of Microelectronics / 教授 Tsinghua University / 清华大学微电子学研究所. She received the IMAPS GBC Partnership award in 2012 and the Daniel C. Hughes, Jr. Memorial Award in 2018. Ms. Orlando went on to run a division of Duramax, leading projects for major industrial entities, defense contractors, and branches of the military. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer. Ms. Orlando joined Nanotronics as employee number three, where she is currently Chief Product Officer. In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He also received joint Executive MBA degrees from University of California at Berkeley, and Columbia University in New York, in 2007. 薄Si片处理的自动化, 缺陷/污染控制, 等) 以迈向极优异性能 , 良品率，和可靠性. Prior to joining ON Semi/Quantenna Communications, he headed semiconductor manufacturing operations and quality functions at Synerchip Corporation (acquired by Silicon Image) & SiTime (a MEMS based timing solution company). Dr.-Ing. He holds over 100 US patents in the field of semiconductor packaging. Dr. Li participated in the establishment of Simgui and has served many roles in that company since 2001, including: Assistant to the President; Vice President; and Secretary of the Board. Mr. Graf is mainly responsible for marketing and investor relations and organises the public presentation of 0eC. Farhat holds a Master of Science degree in Electrical Engineering from University of Arkansas at Fayetteville. Photo: VCG. Later joined Balzers/Oerlikon responsible for display equipment division and materials division. Steven earned his Bachelor’s Degree from Fife College of Technology, Scotland, UK. Dr. WEI returned to China in 1995. Dr. Karl Breidenbach is a Senior Director at Infineon Technologies AG’s procurement production partner organization. We will provide you with a planned schedule prior to the Event. Geopolitics plays a role in explaining why China’s chip production trails that of Taiwan, South Korea and Japan. China International Semiconductor Executive Summit offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry. Key areas to be addressed are design for reuse, higher abstraction levels to intellectually understand a complex system, agility along with model/design execution and a high professionalism in software development, Vice President, TRUMPF Huettinger Elektronik GmbH. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. CSTIC 2021, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. He was the CTO of Datang Telecom Industry Group from 2005 to 2006. He has 257 US patents; published 3 books, and 100+ technical papers in areas of CMOS Logic/FinFET, Flash memory, CMOS Imager, DRAM, and Power devices. Advanced Workflows for Accelerating Time-to-Market and Yield Learning. 3D integration technology is the main solution that can meet the required performance of applications like AI and HPC. As China emerges as leaders in advanced logic and memory fabrication and advanced chip design, the need for tools that accelerate yield learning and deliver great ROI in terms of Time-to-Market and automation become increasingly relevant. Currently Dr. Yao serves as the company’s CEO and president. (MSc) Production Technology from Technical University of Munich and PhD from Technical University of Stuttgart, Starting 1989 applied research at Fraunhofer Institute of Production Technology and Automation for Semiconductor customers, From 1996 on Olaf Herzog served at Advanced Micro Devices in 200/300mm waferfab startups in the roles of Director Factory Automation, Production Module Head and Director Manufacturing, Starting 2010 Olaf Herzog took responsibility as Director Manufacturing Engineering and as Director Factory Automation for a 300mm waferfab at Globalfoundries, In 2014 Olaf Herzog joined Infineon Technologies AG. You the delegate, your executive/s or your agents may not transfer or assign any of the rights or obligations of this Agreement (in whole or part) without our prior consent. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.. Currently Jennifer manages a global team with R&D, Operations, Marketing and Application resources in US, Europe, Greater Chinaand South East Asia. Born in the Netherlands Wim got his PhD in electrical Engineering from the Technical University in Delft. Instant data generation requires ultra-low-power devices with an ìalways-onî feature at the same time with high-performance devices that can generate the data instantly. He is a senior member of IEEE. 3 Feb 2021 - 4:12AM CAD has three businesses: Environmental and Process Monitoring (EPM), Mineral and Material (M&M) and Field Security Instrument (FSI). Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. M.J. Wolf is actively involved in a number of research projects on national, European and international level. Sabi received his Ph.D.in solid-state electronics from Ohio State University in 1984. He received the bachelor and master’s degree in engineeringfrom the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. Huawei designs its own high-end chipsets but cannot produce them in-house. Dr. Min-hwa Chi received his BS, MS, and Ph.D in EE at National Taiwan University, University of Rhode Island, and University of California -Berkeley (1982) respectively. 季明华博士，从加州大学伯克利分校获得博士学位(1982)，拥有38年的国际半导体产业经验，专注于半导体先进技术的研发。曾发表过半导体技术期刊和会议论文99篇，合著书3册, 拥有美國专利257项, 国际专利超过550项。, 季明华博士曾工作于Intel (1982-1989); KFI 技术（1989-1994），美国国家半导体 (1994-1997); 台湾积体电路Tsmc (1997-2005)任资深研发总监; GLOBAL-FOUNDRIES (2011-2015) 任资深技术专家/总监; 中芯国际（2006-2011, 2015-2018）, 和芯恩 (青岛) 集成电路 (2018 )任资深副总。负责20nm平面CMOS相关的技术开发，14nm FinFET技术的器件整合和模块工艺，并参与10nm/7nm FinFET的技术开发。, 季明华博士曾获得台积电杰出专利奖、美国国家半导体公司创新奖、英特尔杰出成就奖等荣誉，并担任青岛大学 和北京大学“兼职教授”、中科院微电子研究所“荣誉教授”、复旦大学“荣誉教授”、美国IEEE终生资深会员等职务。, Smart Manufacturing for Si, SiC, GaN Power Devices in AI Era / 在人工智能时代，智能制造Si, SiC, 和GaN电力器件. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years. Has 12 years top fab process experience of semiconductor, especially in GaN-on-Si process. The information contained on this website does not constitute an offer for products or services. This is in response to US sanctions restricting the supply of chips containing US technology to China. Opportunities in next generation advanced bonding and molding technology. 1. Our primary goal in collecting personal information from you is to give you an enjoyable customised experience whilst allowing us to provide services and features that most likely meet your needs. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. Collaboration, more than ever, is critical to progress. We are in the world moving from traditional computing era to AI and further to intuitive era. Key market applications such as 5G, datacenters and AI are driving an insatiable demand for system memory and storage. Farhat played a pivotal role in making Quantenna successful through manufacturing structure optimization, cost reductions, quality & margins improvement thus enabling Quantenna’s successful IPO in October 2016. EE-architecture, intelligent connected vehicle and automated driving. 5G, AI and IoT systems are going to increase amount of data generation up 163 ZB by 2023 systems and this amount of data generation will require more storage capacity including solid-state nonvolatile flash memory and also require higher data processing capacity for double data rate static memory. Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region. This presentation will highlight some of the new opportunities in bonding and contact technology including Thermal Compression Bonding and Direct Cu-to-C hybrid bonding as well covering advancements in molding technology for advanced packaging. What is our perspective on the NVIDIA arm acquisition? Chip production is a complex process involving different components and manufacturing stages. He received PhD and MSc from University of California Berkeley USA and Peking University, China respectively. Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He developed several multimedia SoCs including smartphone, IPTV, IPC with advanced 28nm technology. We also collect certain personal data from other group companies to whom you have given information through their websites. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards. The first wave did not last and resulted in AI winter. Karl joined Continental in 2008 and had leading positions in engineering and was a vice president, Infotainment & Connectivity Quality in Singapore and Corporate Quality in China. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Chinese technology companies like Alibaba and Huawei have already made a head start in producing these chips to be used in 5G networks. Advanced packaging architectures are today widely acknowledged as being increasingly important to drive performance and cost improvements of microelectronics systems. Post was not sent - check your email addresses! He was responsible for New Business Development, Company Globalization Strategies and Involved in potential merger and acquisition. Please email enquiries[at]ioctr.com for a copy of the CISES Privacy Policy. China should rethink its semiconductor localisation strategy. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, accelerated computing architectures, cellular baseband modems, WLAN, WiMAX, cellular broadband, digital consumer, foundry, EMS, intelligent systems, and overall semiconductors. Your email address will not be published. Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. 今日AI/IoT时代的IC技术，推动了高科技工业的所有层面，并展现为国家的力量. Prior to joining Amkor, he worked in management positions in the areas of Engineering, R&D and Product Marketing. Mr. Jahangir holds a Master of Science degree in Electrical Engineering from the University of Arkansas at Fayetteville. Xin Wu is Vice President of Silicon Technology, XILINX INC. Payment must be received in full within 28 days from the date of this agreement. He currently holds 2 patents. He is IEEE Life Sr. member (2001). After obtaining a masters in business, Phil joined ON Semiconductor and was responsible for field sales and applications team in the Americas region supporting Continental Automotive. Build up advanced technology competency across the company: AI, Cyber Security, Robotics etc. We reserve the right to refuse replacement delegates. Dr. Breidenbach holds a PhD from Bundeswehr University Munich, Master of Science (First Class) from Dublin City University and NEOMA Business School in Supply Chain Management, and a BA from Aston University Birmingham and Baden-Wuerttemberg Cooperative State University Stuttgart in Information Technology and International Business Management. Graduated from Stevens Institute of Technology with a Ph.D. in Material Science & Engineering. Prior to assuming his current role, CL served as VP of Amkor Technology China. In particular, he was instrumental in leading a global corporate carve out to Lenovo in Asia, Europe and the US. Currently he is responsible for Technology & Operations for WLP, Bumping & Test as well as Fan out WLP, Panel Level Package, and SiP business at nepes Corporation Korea as senior vice president taking care of profit & loss in Semiconductor business. The new class of devices consist of a 650V Enhanced Mode Monolithic (All-GaN) Power IC targeting ultra-high frequency AC/DC power adapter. Sébastien joined STMicroelectronics in 2000 and has held various management positions in Corporate Strategy, Strategic Partnerships, Sales and Marketing, and Business Development. A priority in the Chinese Communist Party’s (CCP) 14th Five-Year Plan (2021–25) is to strengthen China’s autonomy in semiconductor production.
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